Job description:

Main Responsibilities

- Design and integrate postFAB and assembly processes; develop MTS(Manufacturing Test Specification) for the flow.

- Review product structure and process PRP(Process Reference Plan); conduct performance and reliability assessments; perform failure analysis(pFA).

- Develop commercializationready package technologies and products(2.5D / 3D / 3.5D).

- Lead multichip integration and systemlevel package development.

- Create packages based on a thorough understanding of FAB, bump, and postFAB processes.

- Execute DOE(Design of Experiments) and statistical analysis; evaluate product characteristics and reliability; conduct failure analysis (pFA).

- Establish project milestones, manage risks, and drive product technology development.

Qualifications:

Required / Preferred Qualifications

- Fundamental knowledge of semiconductor package materials and hands-on integration development experience.

- Experience in PKG product development and project-management tasks.

- Familiarity with semiconductor/packaging processes such as MEOL, BEOL, RDL, CoW, CoP, etc.

- Proven track record developing and qualifying packages for AI, automotive, and networking applications.

- Experience with large BGA and MCM package development.

- Background in heterogeneous integration (2.3-D, 2.5-D, etc.) and related processes.

- Proficiency with development tools and systems (PLM, OSCAR, YMS, G-SPEC, etc.).

- Expertise in post-FAB processes/materials (CVD, CMP, bump, etc.).

- Expertise in assembly processes/materials (dicing, bonding, molding, etc.).

- Capability to manage outsourced PKG development and operations.

- Ability to communicate fluently in English (conversational level) for interaction with overseas customers.

Why is This a Great Opportunity:

This is a great opportunity for you to fully demonstrate your capabilities in a global company.

Salary Type : Monthly

Salary Min : $ 100000

Salary Max : $ 500000

Currency Type : USD